Compliant and crosslinkable thermal interface materials
A Standard patent application filed on 14 September 2000 credited to Grundy, James ; Nguyen, My

Details

Application number :

75856  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Compliant and crosslinkable thermal interface materials  

Inventor :

Grundy, James ; Nguyen, My  

Agent name :

 

Address for service :

 

Filing date :

14 September 2000  

Associated companies :

 

Applicant name :

Honeywell International, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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