Method of bonding a plurality of thermally conductive elements to a substrate
A Standard patent application filed on 04 October 2000 credited to Van Der Voorden, Willem Kornelis Leendert
;
Sagel-Ransijn, Caroline Dorothea
Details
Application number :
75476
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method of bonding a plurality of thermally conductive elements to a substrate
Inventor :
Van Der Voorden, Willem Kornelis Leendert
;
Sagel-Ransijn, Caroline Dorothea