Porous copper powder modified friction material
A Standard patent application filed on 26 April 1994 credited to Jacko, Michael G.
;
Rhee, Seong K.
;
Tsang, Peter H.
Details
Application number :
66690
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Porous copper powder modified friction material
Inventor :
Jacko, Michael G.
;
Rhee, Seong K.
;
Tsang, Peter H.
Agent name :
Shelston IP
Address for service :
Level 21 60 Margaret Street SYDNEY NSW 2000
Filing date :
26 April 1994
Associated companies :
Applicant name :
Allied-Signal Inc.
Applicant address :
Columbia Road & Park Drive Morristown, New Jersey 07960, United states of America