Details
- Application number :
- 74136
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Galvanizing solution for the galvanic deposition of copper
- Inventor :
- Hu, Jung-Chih
;
Gau, Wu-Chun
;
Chang, Ting-Chang
;
Chen, Lih-Juann
;
Cheng, Chun-Lin
;
Lin, You-Shin
;
Li, Ying-Hao
;
Feng, Ming-Shiann
- Agent name :
-
- Address for service :
-
- Filing date :
- 25 August 2000
- Associated companies :
-
- Applicant name :
- Merck Patent GmbH
- Applicant address :
-
- Old name :
-
- Original Source :
- Go