Method for forming tough, electrical insulating layer on surface of copper material
A Standard patent application filed on 18 February 1994 credited to Katsuma, Kunio
Details
Application number :
55224
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Method for forming tough, electrical insulating layer on surface of copper material
Inventor :
Katsuma, Kunio
Agent name :
Davies Collison Cave
Address for service :
Level 15 1 Nicholson Street MELBOURNE VIC 3000
Filing date :
18 February 1994
Associated companies :
Applicant name :
Usui Kokusai Sangyo Kabushiki Kaisha
Applicant address :
131-2 Nagasawa Shimizu-cho Sunto-gun Shizuoka-ken Japan