Heat shrinkable film structures with improved sealability and toughness
A Standard patent application filed on 28 January 1994 credited to Lind, Keith Duane
;
Walbrun, George Herbert
;
Hodson, Jay Daniel
;
Zheng, Johnny Qiang
Details
Application number :
54734
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Heat shrinkable film structures with improved sealability and toughness
Inventor :
Lind, Keith Duane
;
Walbrun, George Herbert
;
Hodson, Jay Daniel
;
Zheng, Johnny Qiang
Agent name :
PHILLIPS ORMONDE FITZPATRICK
Address for service :
367 Collins Street MELBOURNE VIC 3000
Filing date :
28 January 1994
Associated companies :
Applicant name :
Bemis Company, Inc.
Applicant address :
One Neenah Center Fourth Floor 134 E. Wisconsin Street Neenah, Wisconsin 54956 United States Of America