Details

Application number :
52969  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Jack module assembly  
Inventor :
Burroughs, Dennis M. ; Dewey, James D.  
Agent name :
 
Address for service :
 
Filing date :
04 October 1993  
Associated companies :
 
Applicant name :
ADC Telecommunications, Incorporated  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor