Composite microwave circuit module assembly and its connection structure
A Standard patent application filed on 29 October 1993 credited to Kosugi, Yuhei ; Yamamoto, Osamu ; Izumi, Hiroaki ; Minowa, Yoshio ; Omagari, Shinichi ; Watanabe, Hideo ; Kusamitsu, Hideki

Details

Application number :

50371  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Composite microwave circuit module assembly and its connection structure  

Inventor :

Kosugi, Yuhei ; Yamamoto, Osamu ; Izumi, Hiroaki ; Minowa, Yoshio ; Omagari, Shinichi ; Watanabe, Hideo ; Kusamitsu, Hideki  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

29 October 1993  

Associated companies :

 

Applicant name :

NEC Corporation  

Applicant address :

7-1 Shiba 5-chome Minato-ku Tokyo Japan  

Old name :

 

Original Source :

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