Plastic semiconductor package with aluminum heat spreader
A Standard patent application filed on 02 September 1993 credited to Mahulikar, Deepak
;
Chen, Szuchain F
;
Braden, Jeffrey S
Details
Application number :
48428
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Plastic semiconductor package with aluminum heat spreader
Inventor :
Mahulikar, Deepak
;
Chen, Szuchain F
;
Braden, Jeffrey S