Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition
A Standard patent application filed on 28 June 1993 credited to Toma, Hitoshi ; Tsuzuki, Koji ; Takehara, Nobuyoshi ; Mimura, Toshihiko

Details

Application number :

41570  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition  

Inventor :

Toma, Hitoshi ; Tsuzuki, Koji ; Takehara, Nobuyoshi ; Mimura, Toshihiko  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

28 June 1993  

Associated companies :

 

Applicant name :

Canon Kabushiki Kaisha  

Applicant address :

30-2 3-chome Shimomaruko Ohta-ku Tokyo Japan  

Old name :

 

Original Source :

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