Combination die assembly and a method of extrusion using the die assembly
A Standard patent application filed on 26 February 1993 credited to Yano, Sadahide
Details
Application number :
33837
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Combination die assembly and a method of extrusion using the die assembly
Inventor :
Yano, Sadahide
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
26 February 1993
Associated companies :
Applicant name :
Yugen Kaisha Yano Engineering
Applicant address :
15-21 Minamitsumori 7-chome Nishinariku Osakashi Osaka Japan