Package with replaceable inner receptacle having large integrally molded fitment
A Standard patent application filed on 10 December 1992 credited to Kock, Ronald Wayne
;
Satterfield, Richard Darren
;
Willhite, William Jr.
Details
Application number :
32459
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Package with replaceable inner receptacle having large integrally molded fitment
Inventor :
Kock, Ronald Wayne
;
Satterfield, Richard Darren
;
Willhite, William Jr.