Method and device for measuring a semiconductor element with bumps, and method and device for manufacturing a semiconductor device
A Standard patent application filed on 30 June 1992 credited to Nishiguchi, Masanori
Details
Application number :
19328
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Method and device for measuring a semiconductor element with bumps, and method and device for manufacturing a semiconductor device