Heat sealable multilayer polyolefinic film structures
A Standard patent application filed on 07 January 1992 credited to Koch, Kaelyn C
;
Chum, Pak-Wing S
Details
Application number :
12316
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Heat sealable multilayer polyolefinic film structures
Inventor :
Koch, Kaelyn C
;
Chum, Pak-Wing S
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
07 January 1992
Associated companies :
Applicant name :
Dow Chemical Company, The
Applicant address :
2030 Dow Center Abbott Road Midland MI 48640 United States Of America