Method for processing semiconductor wafer, method for manufacturing IC card, and carrier

Application number :: 68071
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Method for processing semiconductor wafer, method for manufacturing IC card, and carrier
Inventor :: Miyamoto, Toshio ; Tsubosaki, Kunihiro ; Usami, Mitsuo
Agent name :: FB Rice
Address for service :: Level 23 44 Market Street SYDNEY NSW 2000
Filing date :: 24 October 2000
Associated companies :
Applicant name :: Hitachi Limited
Applicant address :: 6 Kanda Surugadai 4-chome Chiyoda-ku Tokyo Japan
Old name :
Original Source :: Go

Method for processing semiconductor wafer, method for manufacturing IC card, and carrier A Standard patent application filed on 24 October 2000 credited to Miyamoto, Toshio ; Tsubosaki, Kunihiro ; Usami, Mitsuo