Boiling and condensing heat transfer type cooler device for power semiconductor switching elements

Application number :: 83707
Application type :: Standard
Application status :: CEASED
Under opposition :: No
Proceeding type :
Invention title :: Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
Inventor :: Kameda, Takashi ; Takahashi, Nobuyoshi ; Ashiya, Masahiro ; Mori, Kenichi ; Yoshioka, Takeo
Agent name :: Griffith Hack
Address for service :: GPO Box 4164 SYDNEY NSW 2001
Filing date :: 06 September 1991
Associated companies :
Applicant name :: Mitsubishi Denki Kabushiki Kaisha
Applicant address :: 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo, Japan
Old name :
Original Source :: Go

Boiling and condensing heat transfer type cooler device for power semiconductor switching elements A Standard patent application filed on 06 September 1991 credited to Kameda, Takashi ; Takahashi, Nobuyoshi ; Ashiya, Masahiro ; Mori, Kenichi ; Yoshioka, Takeo