Semiconductor package connecting method, semiconductor package connecting wires and semiconductor devices
A Standard patent application filed on 17 December 1990 credited to Ogashiwa, Toshinori

Details

Application number :

68124  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor package connecting method, semiconductor package connecting wires and semiconductor devices  

Inventor :

Ogashiwa, Toshinori  

Agent name :

Madderns  

Address for service :

GPO Box 2752 ADELAIDE SA 5001  

Filing date :

17 December 1990  

Associated companies :

 

Applicant name :

Tanaka Denshi Kogyo Kabushiki Kaisha  

Applicant address :

6-6, Nihonbashi Kayaba-cho, 2-chome, Chuoh-ku, Tokyo, Japan  

Old name :

 

Original Source :

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