A wafer-level micro-cap package and method of manufacturing the same
A Standard patent application filed on 04 August 2000 credited to Li, Guann-Pyng Ph.D. ; Young, Michael T. ; Chiang, Yuh-Min ; Chu, Charles ; Bachman, Mark

Details

Application number :

66242  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A wafer-level micro-cap package and method of manufacturing the same  

Inventor :

Li, Guann-Pyng Ph.D. ; Young, Michael T. ; Chiang, Yuh-Min ; Chu, Charles ; Bachman, Mark  

Agent name :

 

Address for service :

 

Filing date :

04 August 2000  

Associated companies :

 

Applicant name :

Regents of the University of California, The  

Applicant address :

 

Old name :

 

Original Source :

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