Imperviously sealed and compact electronic module

Application number :: 62157
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Imperviously sealed and compact electronic module
Inventor :: Teissier, Gerard ; Billet, Daniel ; Buchholtzer, Bernard ; Droguet, Jean-Paul
Agent name :: SPRUSON & FERGUSON
Address for service :: GPO Box 3898 SYDNEY NSW 2001
Filing date :: 04 September 1990
Associated companies :
Applicant name :: Thomson-CSF
Applicant address :: 51, Esplanade du general de Gaulle, 92800 Puteaux, France
Old name :
Original Source :: Go

Imperviously sealed and compact electronic module A Standard patent application filed on 04 September 1990 credited to Teissier, Gerard ; Billet, Daniel ; Buchholtzer, Bernard ; Droguet, Jean-Paul