Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing
A Standard patent application filed on 06 July 2000 credited to Wehl, Wolfgang

Details

Application number :
64325  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing  
Inventor :
Wehl, Wolfgang  
Agent name :
 
Address for service :
 
Filing date :
06 July 2000  
Associated companies :
 
Applicant name :
Ekra Eduard Kraft GmbH  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor