High speed contact sealer
A Standard patent application filed on 13 November 1989 credited to Evans, Alfred J.
;
Whittlesey, Thomas E.
;
Brinson, Edward P.
;
Chen, Grant K.
;
May, Dennis J.
Details
Application number :
46679
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
High speed contact sealer
Inventor :
Evans, Alfred J.
;
Whittlesey, Thomas E.
;
Brinson, Edward P.
;
Chen, Grant K.
;
May, Dennis J.
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
13 November 1989
Associated companies :
Applicant name :
Delaware Capital Formation, Inc.
Applicant address :
1100 Market Street, Suite 780, Wilmington, DE 19801, United States of America