Two tier hi-speed wireless communication link
A Standard patent application filed on 19 July 2000 credited to Bishop, R. Adrian ; Page, John V. ; Gorsuch, Thomas E.

Details

Application number :

63559  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Two tier hi-speed wireless communication link  

Inventor :

Bishop, R. Adrian ; Page, John V. ; Gorsuch, Thomas E.  

Agent name :

 

Address for service :

 

Filing date :

19 July 2000  

Associated companies :

 

Applicant name :

Tantivy Communications, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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