Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof
A Standard patent application filed on 04 August 1989 credited to Schenkel, Hubert
Details
Application number :
39322
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Reactive hot-melt adhesive containing a resin component and a thermally activatable, latent curing agent, a process for producing said adhesive and uses thereof
Inventor :
Schenkel, Hubert
Agent name :
Davies Collison Cave
Address for service :
Level 15 1 Nicholson Street MELBOURNE VIC 3000
Filing date :
04 August 1989
Associated companies :
Applicant name :
Teroson GmbH
Applicant address :
Hans-Bunte-Strasse 4 Heidelberg 1, 6900 Federal Republic of Germany