Method for manufacturing thin-film integrated circuits resistant to damage during flexion

Application number :: 39156
Application type :: Standard
Application status :: CEASED
Under opposition :: No
Proceeding type :
Invention title :: Method for manufacturing thin-film integrated circuits resistant to damage during flexion
Inventor :: Wenz, Robert Paul
Agent name :: SPRUSON & FERGUSON
Address for service :: GPO Box 3898 SYDNEY NSW 2001
Filing date :: 01 August 1989
Associated companies :
Applicant name :: Minnesota Mining and Manufacturing Company
Applicant address :: 3M Center Saint Paul Minnesota 55144-1000 United States Of America
Old name :
Original Source :: Go

Method for manufacturing thin-film integrated circuits resistant to damage during flexion A Standard patent application filed on 01 August 1989 credited to Wenz, Robert Paul