Mold assembly, and methods of mounting and removing insert thereof, and ejecting the insert
A Standard patent application filed on 27 April 1989 credited to Nishimoto, Tatsuo
;
Nakagawa, Tatsuzi
Details
Application number :
33800
Application type :
Standard
Application status :
EXPIRED
Under opposition :
No
Proceeding type :
Invention title :
Mold assembly, and methods of mounting and removing insert thereof, and ejecting the insert
Inventor :
Nishimoto, Tatsuo
;
Nakagawa, Tatsuzi
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
27 April 1989
Associated companies :
Applicant name :
Aida Engineering Ltd.
Applicant address :
2-10 Ohyamacho Sagamihara-city Kanagawa Pref. 229 Japan