Method of bonding thermoplastic material using radio frequency energy
A Standard patent application filed on 18 April 1989 credited to Jensen, Richard K. ; Mandano, Barbara Jean

Details

Application number :

33133  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of bonding thermoplastic material using radio frequency energy  

Inventor :

Jensen, Richard K. ; Mandano, Barbara Jean  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

18 April 1989  

Associated companies :

 

Applicant name :

Plastics Welding Technology, Inc.  

Applicant address :

8730 East 82nd Street Indianapolis Indiana 46256 United States Of America  

Old name :

 

Original Source :

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