A resin sealed semiconductor device and a method for making the same

Application number :: 16920
Application type :: Standard
Application status :: CEASED
Under opposition :: No
Proceeding type :
Invention title :: A resin sealed semiconductor device and a method for making the same
Inventor :: Shibata, Hiroshi ; Kato, Hidetoshi ; Shintai, Akira ; Maehara, Fuyuki
Agent name :: Griffith Hack
Address for service :: GPO Box 4164 SYDNEY NSW 2001
Filing date :: 31 May 1988
Associated companies :
Applicant name :: Nippondenso Co. Ltd.
Applicant address :: 1,1-chome, Showa-cho, Kariya-shi, Aichi-ken, Japan
Old name :
Original Source :: Go

A resin sealed semiconductor device and a method for making the same A Standard patent application filed on 31 May 1988 credited to Shibata, Hiroshi ; Kato, Hidetoshi ; Shintai, Akira ; Maehara, Fuyuki