Details

Application number :
27182  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Microdot bonding apparatus  
Inventor :
Cohen, Marvin ; Filipovich, Danny ; Mancin, Susanne C.  
Agent name :
 
Address for service :
 
Filing date :
16 November 1988  
Associated companies :
 
Applicant name :
Ident Corporation of America, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

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