Modular assembly of antibody genes, antibodies prepared thereby and use

Application number :: 23244
Application type :: Standard
Application status :: EXPIRED
Under opposition :: No
Proceeding type :
Invention title :: Modular assembly of antibody genes, antibodies prepared thereby and use
Inventor :: Robinson, Randy R. ; Liu, Alvin Y. ; Better, Marc ; Wall, Randolph ; Horwitz, Arnold H.
Agent name :: SPRUSON & FERGUSON
Address for service :: GPO Box 3898 SYDNEY NSW 2001
Filing date :: 25 July 1988
Associated companies :
Applicant name :: Xoma Corporation
Applicant address :: 2910 - 7th Street Berkeley California 94710 United States Of America
Old name :: International Genetic Engineering, Inc.
Original Source :: Go

Modular assembly of antibody genes, antibodies prepared thereby and use A Standard patent application filed on 25 July 1988 credited to Robinson, Randy R. ; Liu, Alvin Y. ; Better, Marc ; Wall, Randolph ; Horwitz, Arnold H.