A blister-free pressure-sensitive adhesive sheet
A Standard patent application filed on 16 August 1988 credited to Maruoka, Shigenobu ; Saito, Takanori ; Tsuchida, Ichiro

Details

Application number :
21022  
Application type :
Standard  
Application status :
CEASED  
Under opposition :
No  
Proceeding type :
 
Invention title :
A blister-free pressure-sensitive adhesive sheet  
Inventor :
Maruoka, Shigenobu ; Saito, Takanori ; Tsuchida, Ichiro  
Agent name :
PHILLIPS ORMONDE FITZPATRICK  
Address for service :
367 Collins Street MELBOURNE VIC 3000  
Filing date :
16 August 1988  
Associated companies :
 
Applicant name :
Lintec Corporation  
Applicant address :
23-23 Honcho Itabashi-ku Tokyo Japan  
Old name :
FSK Corporation  
Original Source :
Go  

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