Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer
A Standard patent application filed on 24 May 1988 credited to Suzuki, Masahiro ; Yamamoto, Haruhiko ; Udagawa, Yoshiaki

Details

Application number :
16557  
Application type :
Standard  
Application status :
CEASED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer  
Inventor :
Suzuki, Masahiro ; Yamamoto, Haruhiko ; Udagawa, Yoshiaki  
Agent name :
SPRUSON & FERGUSON  
Address for service :
GPO Box 3898 SYDNEY NSW 2001  
Filing date :
24 May 1988  
Associated companies :
 
Applicant name :
Fujitsu Limited  
Applicant address :
1015, Kamikodanaka, Nakahara-ku, Kawasakishi Kanagawa 211, Japan.  
Old name :
 
Original Source :
Go  

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