Hot melt adhesive for polyethylene film reinforcement
A Standard patent application filed on 18 May 1988 credited to Chen, Franklin Ming Chi
;
Soerens, Dave Allen
;
Van Bemmel, William Ray
;
Linker, Paul Means
Details
Application number :
16389
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Hot melt adhesive for polyethylene film reinforcement
Inventor :
Chen, Franklin Ming Chi
;
Soerens, Dave Allen
;
Van Bemmel, William Ray
;
Linker, Paul Means