Thermal transfer of microstructured layers
A Standard patent application filed on 24 March 2000 credited to Wolk, Martin B. ; Debe, Mark K

Details

Application number :

58660  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thermal transfer of microstructured layers  

Inventor :

Wolk, Martin B. ; Debe, Mark K  

Agent name :

 

Address for service :

 

Filing date :

24 March 2000  

Associated companies :

 

Applicant name :

3M Innovative Properties Company  

Applicant address :

 

Old name :

 

Original Source :

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