Method for producing a supporting element for an integrated circuit module for placement in chip cards
A Standard patent application filed on 30 September 1999 credited to Fannasch, Lothar
;
Mederski, Gerd
Details
Application number :
12624
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method for producing a supporting element for an integrated circuit module for placement in chip cards