Method for forming vertical interconnects in polyimide insulating layers
A Standard patent application filed on 24 October 1986 credited to Garcia, Socorro
;
Mathur, Vishnu
Details
Application number :
65498
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Method for forming vertical interconnects in polyimide insulating layers
Inventor :
Garcia, Socorro
;
Mathur, Vishnu
Agent name :
Griffith Hack
Address for service :
GPO Box 4164 SYDNEY NSW 2001
Filing date :
24 October 1986
Associated companies :
Applicant name :
Tandem Computers Incorporated
Applicant address :
19333 Vallco Parkway, Cupertino, California 95014-2599, U.S.A.