Improved simulation system for modeling the electromagnetic response of electronic design packages
A Standard patent application filed on 09 June 2000 credited to Jiang, Bonan ; Liao, Ninglan ; Ouyang, Craig C.

Details

Application number :

56044  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Improved simulation system for modeling the electromagnetic response of electronic design packages  

Inventor :

Jiang, Bonan ; Liao, Ninglan ; Ouyang, Craig C.  

Agent name :

 

Address for service :

 

Filing date :

09 June 2000  

Associated companies :

 

Applicant name :

American Applied Research, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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