Copper sputtering target assembly and method of making same
A Standard patent application filed on 02 June 2000 credited to Kardokus, Janine K. ; Buehler, Jane E. ; Parfeniuk, Christopher L. ; Wu, Chi tse

Details

Application number :

55946  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Copper sputtering target assembly and method of making same  

Inventor :

Kardokus, Janine K. ; Buehler, Jane E. ; Parfeniuk, Christopher L. ; Wu, Chi tse  

Agent name :

 

Address for service :

 

Filing date :

02 June 2000  

Associated companies :

 

Applicant name :

Johnson Matthey Electronics, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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