Surface mount package for power semiconductor devices
A Standard patent application filed on 26 May 2000 credited to Williams, Richard K. ; Choi, Alexander K. ; Lam, Allen K.

Details

Application number :

52954  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Surface mount package for power semiconductor devices  

Inventor :

Williams, Richard K. ; Choi, Alexander K. ; Lam, Allen K.  

Agent name :

 

Address for service :

 

Filing date :

26 May 2000  

Associated companies :

 

Applicant name :

Williams, Richard K.  

Applicant address :

 

Old name :

 

Original Source :

Go