Adhesive/sealant composition and bonded structure using the same
A Standard patent application filed on 17 May 2000 credited to Imai, Koji ; Kitano, Shuichi

Details

Application number :

50255  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Adhesive/sealant composition and bonded structure using the same  

Inventor :

Imai, Koji ; Kitano, Shuichi  

Agent name :

 

Address for service :

 

Filing date :

17 May 2000  

Associated companies :

 

Applicant name :

3M Innovative Properties Company  

Applicant address :

 

Old name :

 

Original Source :

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