High-density removable expansion module having i/o and second-level removable expansion memory
A Standard patent application filed on 09 May 2000 credited to Gifford, Michael L. ; Mills, Kevin J.

Details

Application number :
50010  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
High-density removable expansion module having i/o and second-level removable expansion memory  
Inventor :
Gifford, Michael L. ; Mills, Kevin J.  
Agent name :
 
Address for service :
 
Filing date :
09 May 2000  
Associated companies :
 
Applicant name :
Socket Communications, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor