Details
- Application number :
- 47652
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Hot-bond method for bonding an electronic module in a chip card
- Inventor :
- Elbaz, Didier
- Agent name :
-
- Address for service :
-
- Filing date :
- 18 May 2000
- Associated companies :
-
- Applicant name :
- Gemplus
- Applicant address :
-
- Old name :
-
- Original Source :
- Go