Microwave bonding of mems component
A Standard patent application filed on 20 April 2000 credited to Barmatz, Martin B. ; Mai, John D. ; Jackson, Henry W. ; Budra, Nasser K. ; Pike, William T.

Details

Application number :

46513  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Microwave bonding of mems component  

Inventor :

Barmatz, Martin B. ; Mai, John D. ; Jackson, Henry W. ; Budra, Nasser K. ; Pike, William T.  

Agent name :

 

Address for service :

 

Filing date :

20 April 2000  

Associated companies :

 

Applicant name :

California Institute of Technology  

Applicant address :

 

Old name :

 

Original Source :

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