Solution polymerization process and adhesive, sealant, and mastic compositions made therefrom
A Standard patent application filed on 07 May 2009 credited to Wortman, David E.
;
Doyle, Denny
;
Thompson, Tobias N.
;
Ford, Nicholas J.
;
Dutta, Sandipan
;
Vrana, Mark
Details
Application number :
2009246955
Application type :
Standard
Application status :
FILED
Under opposition :
No
Proceeding type :
Invention title :
Solution polymerization process and adhesive, sealant, and mastic compositions made therefrom
Inventor :
Wortman, David E.
;
Doyle, Denny
;
Thompson, Tobias N.
;
Ford, Nicholas J.
;
Dutta, Sandipan
;
Vrana, Mark
Agent name :
Wrays
Address for service :
Ground Floor 56 Ord Street West Perth WA 6005 Australia
Filing date :
07 May 2009
Associated companies :
Applicant name :
Franklin International, Inc.
Applicant address :
2020 Bruck Street Columbus OH 43207 United States of America