Vacuum skin packaging laminate, package and process for using same
A Standard patent application filed on 22 January 2009 credited to Berbert, Otacilio Teixeira ; Latreille, Douglas Mark

Details

Application number :

2009200235  

Application type :

Standard  

Application status :

FILED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Vacuum skin packaging laminate, package and process for using same  

Inventor :

Berbert, Otacilio Teixeira ; Latreille, Douglas Mark  

Agent name :

Watermark Patent and Trade Marks Attorneys  

Address for service :

Level 2 302 Burwood Road Hawthorn VIC 3122 Australia  

Filing date :

22 January 2009  

Associated companies :

 

Applicant name :

Curwood Inc  

Applicant address :

2200 Badger Avenue Oshkosh Wisconsin 54904 United States of America  

Old name :

 

Original Source :

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