Ring binder mechanism with polymeric housing
A Standard patent application filed on 05 August 2008 credited to To, Chun Yuen
;
Huang, Ming Hua
;
Pi, Jin Biao
Details
Application number :
2008203494
Application type :
Standard
Application status :
FILED
Under opposition :
No
Proceeding type :
Invention title :
Ring binder mechanism with polymeric housing
Inventor :
To, Chun Yuen
;
Huang, Ming Hua
;
Pi, Jin Biao
Agent name :
Pizzeys
Address for service :
Level 2, Woden Plaza Offices Woden Town Square Woden Canberra ACT 2606 Australia
Filing date :
05 August 2008
Associated companies :
Applicant name :
World Wide Stationery Mfg. Co., Ltd.
Applicant address :
19/F., Koon Wah Mirrors Factory 3rd Industrial Bldg. 5-9 Ka Hing Road Kwai Chung New Territory The Hong Kong Special Administrative Region of the People's Republic of China