Sheet for printed wiring board, method of forming via, resin sheet having filledvia, printed wiring board and method of manufacturing the same
A Standard patent application filed on 01 May 2000 credited to Nakamura, Toshiyuki ; Tanaka, Hideto ; Arai, Daisuke ; Takahashi, Motonobu ; Ishii, Masato ; Ichiryu, Akira

Details

Application number :

43167  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Sheet for printed wiring board, method of forming via, resin sheet having filledvia, printed wiring board and method of manufacturing the same  

Inventor :

Nakamura, Toshiyuki ; Tanaka, Hideto ; Arai, Daisuke ; Takahashi, Motonobu ; Ishii, Masato ; Ichiryu, Akira  

Agent name :

 

Address for service :

 

Filing date :

01 May 2000  

Associated companies :

 

Applicant name :

Mitsui Mining & Smelting Co., Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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