Details
- Application number :
- 2007200924
- Application type :
- Standard
- Application status :
- SEALED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- High strength stick electrode
- Inventor :
- Kapoor, Ashish
;
Morlock, Michael J.
;
Dallam, Craig
- Agent name :
- Spruson & Ferguson
- Address for service :
- Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia
- Filing date :
- 02 March 2007
- Associated companies :
-
- Applicant name :
- Lincoln Global, Inc.
- Applicant address :
- 17721 Railroad Street City of Industry California 91748 United States of America
- Old name :
-
- Original Source :
- Go