Use of sub-micron copper salt particles in wood preservation
A Standard patent application filed on 12 December 2005 credited to Hodge, Robert L. ; Richardson, H. Wayne

Details

Application number :

2005316737  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Use of sub-micron copper salt particles in wood preservation  

Inventor :

Hodge, Robert L. ; Richardson, H. Wayne  

Agent name :

Wrays  

Address for service :

Ground Floor 56 Ord Street West Perth WA 6005 Australia  

Filing date :

12 December 2005  

Associated companies :

 

Applicant name :

Phibro-Tech, Inc.  

Applicant address :

65 Challenger Road Ridgefield Park NJ 07660 United States of America  

Old name :

 

Original Source :

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