Cutting segment, method of manufacturing cutting segment, and cutting tool
A Standard patent application filed on 07 February 2005 credited to Kim, Soo-Kwang
;
Park, Hee-Dong
Details
Application number :
2005235481
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Cutting segment, method of manufacturing cutting segment, and cutting tool
Inventor :
Kim, Soo-Kwang
;
Park, Hee-Dong
Agent name :
Spruson & Ferguson
Address for service :
Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia
Filing date :
07 February 2005
Associated companies :
Applicant name :
Ehwa Diamond Industrial Co., Ltd.
Applicant address :
520-2 Won-dong Osan Kyungki-do 447-060 Republic of Korea