Modular head lamination device and method
A Standard patent application filed on 14 February 2006 credited to Lum, Matthew K.
;
Kramp, Robert, A.
;
Wampler, Robert R.
;
Kisch, Robert A.
Details
Application number :
2006214400
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Modular head lamination device and method
Inventor :
Lum, Matthew K.
;
Kramp, Robert, A.
;
Wampler, Robert R.
;
Kisch, Robert A.
Agent name :
Spruson & Ferguson
Address for service :
Level 35 St Martins Tower 31 Market Street Sydney NSW 2000 Australia
Filing date :
14 February 2006
Associated companies :
Applicant name :
The Boeing Company
Applicant address :
100 N. Riverside Plaza Chicago IL 60606 United States of America